Kulicke and Soffa Industries, Inc. (KLIC)

NasdaqGS · Semiconductor Equipment & Materials

91.18
-10.59 (-10.41%)
Updated Aug 18, 5:57 PM ET
AI Rating
Hold
Overall Score
46
Trend
32
Momentum
60
Risk
48

Scores are generated from technical indicators for educational purposes and are not a recommendation to buy or sell.

Price history

Daily closes and volume
Feb 23, 2026 120 sessions Aug 14, 2026

AI Analysis

Kulicke and Soffa Industries, Inc. is trading at $91.18, down 10.41% on the session. The 50 day average sits at $106.63 and the 200 day at $n/a, which puts the stock in a mixed technical position. RSI is at 51.3, which reads as neutral, and MACD is bullish crossover. Volume is below average.

The nearest support is around $99.00 with resistance near $108.96, so that band frames the current range. Average daily movement is roughly $7.16, or about 7.9% of the share price, which is what any stop placement has to allow for. The overall health score of 46 out of 100 combines a trend score of 32, momentum of 60 and a risk score of 48.

Technical indicators

RSI (14)
51.3
neutral
MACD
-3.432
bullish crossover
SMA 20
94.36
SMA 50
106.63
SMA 200
--
unknown
ATR (14)
7.16
avg daily range
Support
99.00
Resistance
108.96
Volume vs 20d
0.49x
below average
Volatility
70.6%
annualised
1 month
-7.76%
3 months
-4.97%

About Kulicke and Soffa Industries, Inc.

Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and consumables in China, the United States, Taiwan, Malaysia, Japan, the Philippines, Korea, Hong Kong, and internationally. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company provides services used to assemble semiconductor devices, such as integrated circuits, power discretes, light-emitting diode (LEDs), and sensors. It also offers ball bonding equipment, wafer level bonding equipment, and wedge and wedge-related bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares, and services for equipment. In addition, the company services, maintains, repairs, and upgrades equipment; and sells consumable aftermarket solutions and services. It serves integrated device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Singapore.

Company website

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