Amkor Technology, Inc. (AMKR)

NasdaqGS · Semiconductor Equipment & Materials

54.36
-6.94 (-11.32%)
Updated Aug 18, 5:45 PM ET
AI Rating
Hold
Overall Score
41
Trend
28
Momentum
61
Risk
34

Scores are generated from technical indicators for educational purposes and are not a recommendation to buy or sell.

Price history

Daily closes and volume
Feb 24, 2026 120 sessions Aug 14, 2026

AI Analysis

Amkor Technology, Inc. is trading at $54.36, down 11.32% on the session. The 50 day average sits at $67.98 and the 200 day at $n/a, which puts the stock in a mixed technical position. RSI is at 49.5, which reads as neutral, and MACD is bullish crossover. Volume is below average.

The nearest support is around $57.87 with resistance near $71.50, so that band frames the current range. Average daily movement is roughly $4.78, or about 8.8% of the share price, which is what any stop placement has to allow for. The overall health score of 41 out of 100 combines a trend score of 28, momentum of 61 and a risk score of 34.

Technical indicators

RSI (14)
49.5
neutral
MACD
-3.150
bullish crossover
SMA 20
56.17
SMA 50
67.98
SMA 200
--
unknown
ATR (14)
4.78
avg daily range
Support
57.87
Resistance
71.50
Volume vs 20d
0.54x
below average
Volatility
129.6%
annualised
1 month
-6.40%
3 months
-18.17%

About Amkor Technology, Inc.

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

Company website

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